MEMS application service offering
- XinLid-S
- Wafer thinning and bonded wafer partial dicing to reveal bonding pad.
- CSP
- Using Via Last TSV to connect pad on wafer surface toward backside.
- Specialty: Large cavity forming and stress release
- Dry etching silicon to form ultra large cavities to derive product performance needs (eg. Speakers)
Xintec Service: MEMS Sensor
| Wafer in | WLP | Component | Application | |
|---|---|---|---|---|
| Inertial MEMS |    |
 XinLid-S   XinLid-S |
 QFN  XinTSV-B  MEMS-CSP |
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| Ink Jet Printer |  |
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| Speaker |  |
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