MEMS application service offering
- XinLid-S
- Wafer thinning and bonded wafer partial dicing to reveal bonding pad.
- CSP
- Using Via Last TSV to connect pad on wafer surface toward backside.
- Specialty: Large cavity forming and stress release
- Dry etching silicon to form ultra large cavities to derive product performance needs (eg. Speakers)
Xintec Service: MEMS Sensor
Wafer in | WLP | Component | Application | |
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Inertial MEMS | ![]() ![]() ![]() |
![]() XinLid-S ![]() ![]() XinLid-S |
![]() QFN ![]() XinTSV-B ![]() MEMS-CSP |
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Ink Jet Printer | ![]() |
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Speaker | ![]() |
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