Quality Policy

Xintec focus on innovative 3D Wafer Level Chip Scale Packaging (3D WLCSP) foundry and related services. Our core value is integrity, innovation, and customer orientation. Apply corporate governance, social responsibility, be accountable to stakeholders.

Xintec commits to achieve and continually improve the following:
1. Fulfill the regulations of government and customers.
2. Drive for continuous improvement for risk assessment.
3. Staying abreast of global environmental protection trend, and enhance green responsibility, to provide green products and construct a green supply chain.
4. Continue to promote sustainable development.


Quality Management System

Xintec quality management system applies the plan-do-check-action cycle method of IATF16949, and has a complete customer-orientation process to control quality.


Xintec quality management system is constructed the semiconductor packaging process technology research and development, manufacturing, quality control and customer service to support Xintec business strategies.
Quality and Reliability members work closely with engineering teams and customers to improve processes, stabilize quality and ensure customer satisfaction.