Customized Service Introduction
- 3D I/O Redistribution
- Lower bond pad level so sensor may be seamlessly attach to flat surface.
- Power ground enhancement
- Using TSV to connect ground pads with backside Cu plating for heat dissipation and noise reduction needs.
- Dual side connection
- DOffer Ni/Pd/Au or Cu pillar on wafer surface with TSV to connect top side chip and bottom side substrate.
Xintec Service: Customized Service
| Wafer in | Wafer Level Process | Component | Application | |
|---|---|---|---|---|
| 3D I/O RDL |  |
 XinPPI-M |
|
|
| Power Ground Enhance |  XinTSVG |
 QFN |
|
|
| Dual side connect |  Lidless-TSV  Duo-C |
 
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