Wafer Level Packaging (WLP), or Wafer Level Chip Scale Packaging (WLCSP)
WLCSP refers to the technology of packaging an integrated circuit at wafer level, instead of the traditional process of assembling the package of each individual unit after wafer dicing. WLP is essentially a true chip scale packaging (CSP) technology, since the resulting package is practically of the same size as the die. The advantages of WLP include smaller size (reduced footprint and thickness), lesser weight, relatively easier assembly process, lower production costs, and improvement in electrical performance. It is therefore ideal for use in mobile devices like cell phones, laptops, palmtops, and digital cameras. Furthermore, wafer-level packaging paves the way for true integration of wafer fab, packaging, test, and burn-in at wafer level, for the ultimate streamlining of the manufacturing process undergone by a device from silicon start to customer shipment.
Wafer level packaging basically consists of extending the wafer fab processes to include device interconnection and device protection processes. However, there is no single industry-standard method of doing this at present. The technology that Xintec offers including redistribution layer, printing bump and ball placement commonly offered in the industry.