Xintec engages in innovative Wafer Level Chip Size Packaging (WL-CSP) service, packaging foundry and related services. To provide world-class quality products, we strive to achieve total customer satisfaction, provide an injury-free and healthful workplace, and work toward sustainable development to maximizing our resource utilization and minimizing the environmental impact of our operations.
Xintec follows international quality standards, including ISO9000, ISO14000, TS16949, TL9000, and OHSAS 18001 to build its quality management system into Xintec’s core processes to assure customer satisfaction. As an Applicant Member of the Electronic Industry Citizenship Coalition (EICC), Xintec will strive to progressively align its own operations with the provisions of the EICC code of conduct and to support and encourage its own first-tier suppliers to do the same.
Xintec specifically commits to the following:
- Sustainable Development
Conserve natural resources and minimize or eliminate adverse ESH effects and risks associated with our operations, products, and services for continuous improvement.
Ensure that our employees have the awareness, skills, and resources to carry out their activities in a manner consistent with this commitment.
Meet or exceed applicable government regulations and company policies.
- Business Integration
Incorporate ESH considerations into our business strategy and integrate into our routine operations.
- Customers & Stakeholders
Maintain an open and factual dialogue with our customers and other stakeholders.
- Suppliers & Contractors
Establish relationships with suppliers and contractors committed to responsible operations and work together to enhance ESH performance, and involving them in the pertinent ESH procedures.
- Community & Government
Operate as responsible members of the communities in which we live and work and participate in government ESH initiatives.