Xintec has established the capabilities of thermal, mechanical, and electrical characterizations to work closely with our customer for co-designing specific packages or resolving reliability related issues. Xintec has an experienced and professional modeling team to provide technical analysis and consulting services, which covers thermal resistance (still air & forced air environments), package-level mechanical stress analysis, board-level solder fatigue and drop test analysis, critical net R, L, C extraction and signal integrity (SI) analysis.
Capabilities of Package Characterizations
