Micro-electro-mechanical System (MEMS) Packaging
Micro-Electro-Mechanical Systems (MEMS), also referred to as micromachines (in Japan), or Micro Systems Technology - MST (in Europe), is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.
MEMS promises to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, making possible the realization of complete systems-on-a-chip. MEMS is an enabling technology allowing the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications. Numerous applications for MEMS and Nanotechnology have been introduced. Adoption of MEMS in the area of sensors, accelerometer, gyroscope, inkjet printer, microphones, digital mirror displays, micro fluidic devices and communication are available in the market.
MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirements that many of these devices be in contact with their environment. Leveraged with the existing wafer level package technology, Xintec’s expertise on wafer level capping, I/O redistribution, MEMS release, wafer thinning, micro-etching, 3D-lithography… technologies could be readily transferable to MEMS packaging. Our capability in microfabrication technology will help customers to develop tailored wafer level package solution for specific product application with competitive cost and smaller form factor to ensure customer product success in market place.
