Xintec was founded in 1998, located in Jhongli Industrial Park, Taiwan. TSMC strategically invested Xintec in 2007 and has become the largest share holder. The vision is to enable Xintec as a world class backend assembly company. Xintec engages in innovative Wafer Level Chip Size Packaging (WL-CSP) service, and this technology is considered as one of the most advanced packaging technology. Xintec has been specialized in this technology from the beginning and provides packaging service to global market.
The Wafer Level Chip Size Packaging can meet the high growing market demand for miniaturization and high performance since its meritorious characteristics of Transparent, Hermetic and Miniature. To introduce WL-CSP solution which can shorten production cycle time effectively, lower packaging cost and enhance product quality. The WL-CSP will be the trend and the most competitive packaging technology in the semiconductor industry. This Packaging can be applied in a wide range of electronic products, includes: Image Sensors, Optical Sensors, Memory, Analog, ASIC, Mixed Signal…etc.
Xintec's business philosophy is Integrity, Innovation, Practical and Excellence. Xintec has been qualified for ISO9000, ISO14000, and TL9000 certificates. In order to offer the best service, Xintec's R&D team continuously dedicate to process development and improvement. The company's Vision is to be an indispensable partner for miniaturization in the global market.