In order to meet customer needs with minimum risk, Xintec can provide the services from RDL (Re-Distribution Layer) design, mask layout, tooling preparation in many different product segments, including CMOS Image Sensor Chip Scale Package (CIS CSP), Wafer Level Chip Scale Package (WLCSP) and other wafer level packages. Furthermore, Xintec possesses state-of the-art design tools, professional and experienced designers, and design rule checking system to fulfill customer’s specific package designs.
Flow of Design Flow
