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Design Services

In order to meet customer needs with minimum risk, Xintec can provide the services from RDL (Re-Distribution Layer) design, mask layout, tooling preparation in many different product segments, including CMOS Image Sensor Chip Scale Package (CIS CSP), Wafer Level Chip Scale Package (WLCSP) and other wafer level packages. Furthermore, Xintec possesses state-of the-art design tools, professional and experienced designers, and design rule checking system to fulfill customer's specific package designs.

Overview of Design Services

In order to meet customer needs with minimum risk, Xintec can provide the services from RDL (Re-Distribution Layer) design, mask layout, tooling preparation in many different product segments, including CMOS Image Sensor Chip Scale Package (CIS CSP), Wafer Level Chip Scale Package (WLCSP) and other wafer level packages. Furthermore, Xintec possesses state-of the-art design tools, professional and experienced designers, and design rule checking system to fulfill customer's specific package designs.

Design Flow

Design Guide

XinPac XinTSV VTSV XinPPI-Cu
Design Rule
DRC
e-jobview by requested
RDL design
Tooling preparation
SPICE
Spiral inductor

Overview of Modeling Services

Xintec has established the capabilities of thermal, mechanical, and electrical characterizations to work closely with our customer for co-designing specific packages or resolving reliability related issues. Xintec has an experienced and professional modeling team to provide technical analysis and consulting services, which covers thermal resistance (still air & forced air environments), package-level mechanical stress analysis, board-level solder fatigue and drop test analysis, critical net R, L, C extraction and signal integrity (SI) analysis.

Capabilities of Package Characterizations