About Xintec

> About Xintec > Milestone

重要里程碑

2013

Q2
3D I/O Redistribution Technology Production

2012

Q4
Wafer Level Post Passivation Interconnection (XinPPI-Cu) Production
Q2
IR coated Glass CSP on optical sensor Production

2011

Q2
Automotive CSP Image Sensor Production
Q1
JhongLi Line C Acquired

2010

Q4
TS16949 Certified
Q4
Through Silicon Via (XinTSV-Cu) Production
Q2
Power Discrete backside coating service Production
Q1
XinLid for MEMS Cap Saw Production

2009

Q3
Wafer Level Post Passivation Interconnection
Q3
(XinPPI-Al) Production LED Sub Mount Production

2008

Q1
Sony Green Partner Certified

2007

Q4
OHSAS 18001 Certified
Q1
TSMC invested with 43% shares

2006

Q4
JhongLi Line B Ground-Breaking
Q1
TL9000 and ISO14000 Certified

2005

Q4
VisEra invested with 30% shares
Q4
JhongLi Line A 10K/Month output

2003

Q1
ISO9001/ QS9000 Certified

2002

Q4
Chip-Scale Package (CSP) Production

2000

Q4
License ShellCase CSP Technology

1998

Q3
Funded