Xintec was founded in 1998, located in Jhongli Industrial Park, Taiwan. TSMC strategically invested Xintec in 2007 and has become the largest share holder. The vision is to enable Xintec as a world class backend assembly company.
Xintec engages in innovative Wafer Level Chip Size Packaging (WL-CSP) service, and this technology is considered as one of the most advanced packaging technology. Xintec has been specialized in this technology from the beginning and provides packaging service to global market....more
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